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Home ProductsIntegrated Circuit ChipsElectronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I IC

Electronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I IC

Electronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I IC
Electronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I IC
Basic Information
Place of Origin: Shenzhen, China
Brand Name: Xilinx
Certification: Original Part
Model Number: TS3A24159DGSR
Minimum Order Quantity: 1PCS
Price: to be Negotiated
Packaging Details: 676FCBGA
Delivery Time: Immediate
Payment Terms: T/T, Western Union, Paypal, Wechat Pay
Supply Ability: 1 Million pieces per Month
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Packaging: 676FCBGA Product Description: IC FPGA 400 I/O 676FCBGA
Product Type: Transient Suppressors Operating Temp Range: -40C To 100C

Electronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I Integrated Circuits
 
 
 
 
Description :

 

Xilinx 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:

Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

 
 
 
 
Features :

  • Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
  • 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
  • High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
  • High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
  • A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
  • DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
  • Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
  • Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
  • Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
  • Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
  • Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

 
 
 
Technical Specifications :

 

 

 


 
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